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Electronic Packaging Products       Properties of PIM Electronic Package Parts�� Maerial Thermal Expansivity ��ppm/K�� Thermal Conductivity ��W/mK�� Conductivity ��%IACS) Density ��g/cm3�� W��Cu Alloy 6.5��7.2 165��180 31��35 16.1��16.4 Al/SiCp Compound 4��12 120��220 �� 2.0��3.1 KOVAR Alloy 6.2��7.2 15��22 �� 8.15��8.19 AlN Ceramic <6 150��200 �� 3.26��3.30

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